第八届中国系统级封装大会 SiP China

第八届中国系统级封装大会 SiP China

主题演讲 Keynote

主席：芯和半导体科技（上海）股份有限公司创始人&总裁代文亮 Chairman: Wenliang Dai,Founder and President, Xpeedic Co.,Ltd
09:30-09:50	签到及入场 Registration and Networking
09:50-10:00	致辞 Welcome	中国半导体行业协会副秘书长兼封测分会秘书长徐冬梅 Dongmei Xu, Deputy Secretary-General and Secretary-General of the Closed Testing Branch, China Semiconductor Industry Association
10:00-10:25	高算力AI应用下，异构集成系统的机遇与挑战 Heterogeneous Integration Systems for High-Computational AI Applications	芯和半导体科技（上海）股份有限公司创始人&总裁代文亮 Wenliang Dai, Founder and President, Xpeedic Co., Ltd.
10:25-10:50	UCIe 2.0：推动开放芯粒生态的演进和创新 UCIe 2.0: Driving the evolution and innovation of an open core ecosystem	阿里云智能集团首席云服务器架构师和研发总监，CXL和UCle董事会成员陈健 Jian Chen, Chief Cloud Server Architect and Director of Engineering in Alibaba Cloud, member of Board of Directors of CXL and UCIeTM
10:50-11:15	通向个人大模型之路 The Road to Personal Large Models	上海燧原科技股份有限公司首席芯片战略官周强 Alex Zhou，Chief Chip Strategy Officer，Shanghai Enflame Technology Co., Ltd
11:15-11:40	利扬芯片一体两翼战略服务产业发展 Liyang chip integrated two wings strategic service industry development	广东利扬芯片测试股份有限公司总经理张亦锋 Yeefeng Zhang, General Manager, Guangdong Liyang Chip Testing Co., Ltd, President, Dongguan Integrated Circuit Industry Association
11:40-12:05	异质整合的创新与发展 Packaging Innovation & Future by Heterogeneous Integration	日月光半导体制造股份有限公司资深副总陈光雄 Scott Chen, Sr. Vice President, ASE Technology holding Co.Ltd
12:05-12:30	全球及中国半导体市场数据解读 Interpretation of Global and Chinese Semiconductor Market Data	SEMI 半导体事业发展部总监顾文昕 Wenxin Gu, Director of Semiconductor Business Development, SEMI
12:30-13:30	午休及展区参观 Lunch Break & SiP Zone

分论坛一异构系统集成应用 Session 1: Heterogeneous system integration applications

联席主席：阿里云智能集团首席云服务器架构师和研发总监，CXL和UCle董事会成员陈健 Co-Chairman:Jian Chen, Chief Cloud Server Architect and Director of Engineering in Alibaba Cloud, member of Board of Directors of CXL and UCIe
13:30-13:55	异构集成技术的发展与挑战 The Development and Challenges of Heterogeneous Integration	紫光展锐（上海）科技有限公司封装设计部负责人仇元红 William Qiu， Director， Unisoc (Shanghai) Technologies Co., Ltd
13:55-14:20	Chiplet系统SiP、UCIe和3DIC技术的集成革新探索 Innovative Exploration of Integrated Solution of Chiplet System SiP, UCIe and 3DIC technology	新思科技 IP科技高级总监王迎春博士 Dr. Wang Yingchun, Senior Director of IP Technologies, Synopsys
14:20-14:45	芯原Chiplet技术助力设计自动驾驶和高性能计算解决方案 VeriSilicon's Chiplet Technologies Empower Autonomous Driving and High-performance Computing Solutions	芯原股份芯片平台事业部封装工程副总裁陈银龙 Yinlong Chen, Vice President of Packaging Engineering of the Chip Platform Division, VeriSilicon Microelectronics (Shanghai) Co., Ltd
14:45-15:10	3DIC多物理场挑战及应对策略 3DIC multi-physics challenges and coping strategies	安似科技（上海）有限公司 Ansys 半导体事业部技术支持总监张书强 Shuqiang Zhang, Ansys China Semiconductor BU ACE Director, ANSYS
15:10-15:35	突破解决2.5D/3D Chiplet设计与验证中的一些关键问题 Breakthrough solves some key problems in the design and verification of 2.5D/3D chiplets	深圳市比昂芯科技有限公司市场总监赵瑜斌 Yubin Zhao, Marketing Director, BTD Technology
15:35-16:00	走向高性能芯片的必经之路，Chiplet与Die2Die接口 Chiplet & D2D IP, the road to achieve high performance chip	奇异摩尔（上海）集成电路设计有限公司销售副总裁马巍 Eric Ma, Sales VP, kiwimoore
16:00-16:25	EDA使能大算力Chiplet集成系统高速互连接口信号完整性设计 EDA Enables Signal Integrity Design for High Speed Interconnects of HPC Chiplet Systems	芯和半导体科技（上海）股份有限公司技术市场总监黄晓波 Xiaobo Huang, Director of Technical Marketing, Xpeedic Co., Ltd

分论坛三异构系统集成实现(生态圈) Session 3: Heterogeneous system integration implementation (ecosystem)

分论坛主席：奇异摩尔（上海）集成电路设计有限公司产品与解决方案副总裁祝俊东 Session Chairman: Jundong Zhu, Product and Solution VP, Kiwimoore (Shanghai) IC Co., Ltd
09:30-10:00	签到及入场 Registration and Networking
10:00-10:25	异构系统集成实现——OSAT任重道远 Implementation of heterogeneous system integration —— OSAT is a long way to go	长电科技高级专家邬建勇 Jianyong Wu, Senior Expert, JCET
10:25-10:50	UCIe+NoC——AI芯片Die-to-Die互连方案实现 UCIe+NoC——The Die-to-Die Interconnection Solution for AI Chips	上海晟联科半导体有限公司高级市场总监汪成喜 Chengxi Wang, Senior Marketing Director, Shanghai eTopus Technology Co., Ltd
10:50-11:15	Chiplet芯片技术在封装级的相关应用 Related applications of Chiplet chip technology in package level	苏州锐杰微科技集团有限公司董事长方家恩 Jiaen Fang, Chairman, Suzhou Rigger Micro Technologies Group Co., Ltd
11:15-11:40	热仿真技术革新：为前沿电子产品热设计加速赋能 Innovations in Thermal Simulation Technology: Accelerating and Empowering the Thermal Design of Cutting-edge Electronic Products.	芯瑞微（上海）电子科技有限公司高级工程师何佳南 Jayden He, Senior Engineer, PhySim Electronic Technology Co., Ltd.
11:40-12:05	车规高集成系统级扇出封装平台介绍 Introduction to automotive-grade highly integrated system-level fan-out packaging platform	矽磐微电子（重庆）有限公司研发部总监霍炎 Yan Huo, Director of R&D, SiPLP
12:05-13:30	午休及展区参观 Lunch Break & SiP Zone
13:30-13:55	集成电路先进封装材料研究与应用 Research and Application of Advanced Packaging Materials for Integrated Circuits	深圳先进电子材料国际创新研究院院长助理肖彬 Bin Xiao, Dean Assistant, Shenzhen Institute of Advanced Electronic Materials
13:55-14:20	晶圆级先进封装的未来趋势以及微小化对于缺陷检测的影响 Future trends in advanced wafer-level packaging and the impact of miniaturization on defect inspection	KLA Corporation 技术经理裴舜 Eric Pei, Technical Manager, KLA Corporation
14:20-14:45	SiP的新型焊接及清洗方案 New solution of SIP soldering and cleaning	欧纷泰化工（上海）有限公司亚太区技术经理龙泽云 Vincent Long, Technical Manager，Asia, INVENTEC Performance Chemicals (Shanghai) Co., Ltd
14:45-15:10	华天科技：先进封装驱动智能世界发展 HT-tech： Advanced packaging drives the development of intelligent world	华天科技 TPM经理朱浩 Hao Zhu, TPM Manager, HT-TECH
15:10-15:35	BGA先进封装全新的植球工艺 BGA advanced package new ball planting process	广东鸿骐芯智能装备有限公司销售总监胡清松 Megan Hu, Sales Director, Guangdong D-TEK Intelligent Equipment Co., LTD

分论坛四 TGV玻璃基板关键工艺

主持人：厦门云天半导体科技有限公司总监李金喜武汉新创元半导体有限公司副总裁李志东 Session 4: Jovin lee, Marketing Director, Xiamen sky semi conductor teconology Co.,Ltd , Key processes for TGV glass substrates Master of ceremonies: Zhidong Li , VP, Thinktrans Semiconductor Technology Ltd
09:30-10:00	签到及入场 Registration and Networking
10:00-10:25	玻璃通孔关键技术及应用 Key technology and application of glass through hole	三叠纪（广东）科技有限公司电子科技大学教授公司创始人＆董事长张继华 Jihua Zhang, Professor, University of Electronic Science and Technology of China, Founder & Chairman of the Board of Directors of the company, 3D CHIP
10:25-10:50	特种平板玻璃：推动半导体先进封装的关键材料 Specialty flat glass: the key material to promote semiconductor advanced packaging	肖特集团高级经理新业务开发张广军 Guangjun Zhang, Senior Manager, New Business Development，SCHOTT AG
10:50-11:15	探索 TGV（玻璃通孔技術）以实现 PLP（面板级封装）的无限可能性 Exploring TGV (Through Glass Vias) to enable Endless possibilities of PLP (Panel Level Packaging)	泛林半导体资深商务开发总监苏泳桦 Frank Su, Senior Director of Business Development，Lam Research
11:15-11:40	玻璃芯基板：新一代先进的封装技术 Glass Core Substrate: Next Gen Advanced Packaging Technology	安捷利美维电子（厦门）有限责任公司安捷利美维FCBGA总经理汤加苗 Jiamiao Tang, General Manager, Antelimervi FCBGA, AKM Meadville Electronics (Xiamen) Co., Ltd
11:40-12:05	先进玻璃通孔技术进展、应用与挑战 Progress, application and challenges of advanced through glass via technology	厦门云天半导体科技有限公司总监李金喜 Jovin lee, Marketing Director, Xiamen sky semi conductor teconology Co.,Ltd
12:05-13:30	午休及展区参观 Lunch Break & SiP Zone
13:30-13:55	高密度玻璃载板-ROS技术 High-density Glass Substrate--ROS technology	武汉新创元半导体有限公司副总裁李志东 Zhidong Li , VP, Thinktrans Semiconductor Technology Ltd
13:55-14:20	面板级TGV磁控溅射系统 PVD Sputter Tool for Large-Size Panel TGV	深圳市矩阵多元科技有限公司董事长兼首席科学家张晓军 Xiaojun Zhang, Chairman&Chief Scientist, Arrayed Materials (China) Co., Ltd
14:20-14:45	玻璃通孔电镀：单片制程平台 Plating of Through-Glass-Vias：Single Panel Processing Platform	鑫巨（深圳）半导体科技有限公司 CTO 马库思·郎 LANG MARCUS ELMAR, CTO, Simetric Semiconductor Solutions Co., Ltd
14:45-15:10	激光玻璃通孔技术助力TGV产业化 Laser glass through-hole technology promotes TGV industrialization	武汉帝尔激光科技股份有限公司营销副总裁李彦斌 Ben Lee, VP, Sales & Marketing, Wuhan DR Laser Technology Co., Ltd
15:10-15:35	TGV玻璃基板关键检量测技术 Host TGV glass substrate critical measurement technology	政应(上海)科技有限公司副总经理施介皓 Jiehao Shi, Deputy General Manager, Zhengying (Shanghai) Technology Co., Ltd
15:35-16:00	佛智芯TGV工艺挑战和解决方案 Fozhixin TGV process challenges and solutions	广东佛智芯微电子技术研究有限公司首席科学家林挺宇 Tingyu Lin, Chief Scientist, Fzxsmc